ZXONE 8700 Product (The Chinese Market)

  • Overview
    ZXONE 8700 is the large-capacity cross connection equipment. It supports 10G/100G/400Gb/s, enabling large-capacity ODUk electrical cross connection and optical cross connection at wavelengths of 10G/100G/400Gb/s.

    Product Features
    Large-capacity ODUk electrical cross connection
    ZXONE 8700 supports large-capacity electrical cross connection of 0.8T/1.4T/2.8T/3.2T/9.4T and enables non-blocking electrical cross connection of multi-granularity services, including ODU0/1/2/2e/3/4/flex. It can be deployed at aggregation/core nodes in the network.
    OTDR function
    It is easy to measure fiber length and fiber attenuation and locate fiber broken point and fiber fusion point. Realtime query and detection in NMS make daily maintenance and troubleshooting easier. 
    O/E hybrid cross connection and intelligent dispatching
    The optical layer supports 2~20-degree ROADM, N*M WSS, directionless, colorless and contentionless. It can implement automatic E2E configuration of wavelengths.
    It supports WASON control plane in optical and electrical layer.
    Excellent 100G transport
    100Gb/s system adopts PM-QPSK encoding and SD-FEC technology with good OSNR tolerance. The advanced DSP processing technology supports 60ps of PMD tolerance and ± 70000ps/nm of chromatic dispersion tolerance. Transmission distance can reach over 5,000 kilometers without electrical relay, which saves the investments and facilitates the maintenance.
    ZXONE 8700 supports beyond-100G optical networks with 400G per wavelength, providing larger transport capacity.
    PIC (photonic integrated circuit)
    Single subrack supports service access, cross connection, MUX/DEMUX, optical amplification, and clock processing & transport. The PIC technology reduces power consumption and makes the network cost-effective.
    Synchronization
    The system supports out-band/in-band 1588V2 and SyncE clock transport.
    High integration, eco-friendly and energy-saving
    100G line-side boards support coherent CFP modules, greatly reducing power consumption of the system.
    It adopts 28nm ASIC chips integrated with more functions so that it dramatically reduces overall PCB calorific value and energy consumption.
    Highly reliable system architecture
    The system adopts redundant 1+1 hot-standby for main control, power supply and clock units.
    The cross connection unit uses advanced cubic protection, which is higher than common 1+1 protection by three orders of magnitude. It greatly improves the security of the equipment.
    Reliable carrier-class protection
    The system supports fiber-level, λ-level, sub-λ-level and L2 protection modes:
    Fiber-level: line 1+1 protection, optical multiplex section 1+1 protection
    λ-level: optical channel 1+1 protection
    Sub-λ-level: ODUk 1+1 protection
    L2: ESR protection
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