ZTE SELECTS MINDSPEED'S DS3/E3 LINE CARD-ON-A-CHIP SOLUTION FOR 3G WIRELESS PLATFORMS

Release Time:2007-07-13
ZTE SELECTS MINDSPEED'S DS3/E3 LINE CARD-ON-A-CHIP SOLUTION FOR 3G WIRELESS PLATFORMS - ZTE Press Release

ZTE SELECTS MINDSPEED'S DS3/E3 LINE CARD-ON-A-CHIP SOLUTION FOR 3G WIRELESS PLATFORMS

Date:2007-07-13 ZTE Click:285

NEWPORT BEACH, Calif., July 1, 2007 -- Mindspeed Technologies, Inc., (NASDAQ:MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced that ZTE Corporation, a leading global provider of telecommunications equipment and network solutions, has selected Mindspeed's two-port DS3/E3 line card-on-a-chip (LoC) for use in the company's Core Network (CN) and Radio Network Controller (RNC) of W-CDMA 3G wireless platforms. The M29312 LoC integrates two independent DS3/E3 line interface units (LIUs) with framers, ATM/HDLC processors, and telecom application package (TAP) driver software.

The CN and RNC platforms are key elements of ZTE's comprehensive 3G mobile communication solution.

"Mindspeed's two-port LoC is a flexible, cost effective solution that enabled us to develop similar designs for both our RNC and RNC systems," said Mr. Fan Ronghu, the HW Director of ZTE.

"Mindspeed is proud to be part of ZTE's worldwide 3G deployment with our LoC family," said Rammy Bahalul, Senior product line manager for Mindspeed.

The M29312 is an ultra low-power, two-port highly integrated DS3/E3 LoC optimized for low-port density and power-sensitive datacom applications such as wireless uplinks, routers and digital loop carrier equipment. Mindspeed's comprehensive family of DS3/E3 LoCs provide the industry's most highly integrated solutions ranging from one to 12-ports.

Media Contact:Margrete MaZTE CorporationTel: +86 755 26775207Email: ma.gaili@zte.com.cn