Scale-Up卡间互联网络及OISA技术体系

摘要：针对GPU Scale‑Up卡间互联，系统梳理了其发展背景、核心需求与现实挑战，总结了从通用总线、私有协议到开放标准的三阶段演进历程及技术趋势。以中国移动提出的全向智感互联架构（OISA）为分析对象，详细阐述了其架构设计、核心技术特征与创新优势。在此基础上，结合大模型推理阶段键值缓存（KV Cache）的存储通信需求，以及超节点场景下Scale‑Up互联面临的新挑战，对其未来发展方向进行了展望与探讨，为智算网络体系构建及超节点演进提供了参考。研究结果表明，各协议技术正逐渐趋同，开放互联已成为重要发展态势。OISA依托分层协议栈设计与关键技术创新，构建了高效、可靠、灵活、开放的图形处理器（GPU）高速互联体系，为智算服务器向超节点迭代升级提供了关键支撑。

关键词：垂直扩展；Scale-Up；卡间互联；全向智感互联；超节点；智算网络

Abstract: A systematic review is conducted on the background, core requirements, and practical challenges of graphics processing unit (GPU) Scale‑Up interconnection, and its three‑stage evolution from general‑purpose buses and proprietary protocols to open standards, along with corresponding technical trends, is summarized. With the omnidirectional intelligent sensing express architecture (OISA) proposed by China Mobile taken as the analytical object, its architecture design, key technical features, and innovative advantages are elaborated in detail. On this basis, combined with the storage and communication demands of Key-Value (KV) Cache in large‑model inference and the emerging challenges faced by Scale‑Up interconnection in SuperPod scenarios, its future development directions are discussed and prospected, providing references for intelligent computing network construction and SuperPod evolution. The results indicate that interconnection protocols and technologies are gradually converging, and open interconnection has become a key development trend. Based on hierarchical protocol stack design and key technological innovations, OISA establishes an efficient, reliable, flexible, and open high‑speed GPU interconnection system, providing critical support for the iterative upgrade of intelligent computing servers toward SuperPods.

Keywords: vertical expansion; scale-up; intra-node GPU interconnection; omni-directional intelligent sensing express architecture (OISA); SuperPod; intelligent computing network