智能硅基多维复用与处理芯片

 

 

摘要：全面综述了硅基光子单一维度和多个维度的复用与处理，梳理了智能硅基光子集成器件的发展过程。智能硅基多维复用与处理芯片能充分开发和利用光子多维度资源，并能结合硅基光子集成芯片的优势，有望为解决光通信新容量危机和新能耗危机提供核心光电子支撑技术和芯片，从而为实现光通信可持续发展和其他相关应用提供潜在芯片级集成化解决方案。
关键词：硅基光子学；光通信；光子集成芯片；多维复用与处理；人工智能；神经网络


Abstract: In this paper, silicon-based photonic single- and multi-dimensional multiplexing and processing are comprehensively reviewed. The development of intelligent silicon-based photonic integrated devices is also reviewed. Intelligent silicon-based multi-dimensional multiplexing and processing chips can fully develop and make use of multiple physical dimension resources of photons and take the distinct advantages of silicon-based photonic integrated circuits. It is expected to provide the key optoelectronic supporting techniques and chips for addressing the capacity crunch and energy consumption crisis of optical communications. Consequently, intelligent silicon-based multi-dimensional multiplexing and processing chips provide the potential chip-level integrated solutions for realizing the sustainable development of optical communications and other related applications.
Keywords: silicon photonics; optical communications; photonic integrated circuits; multi-dimensional multiplexing and processing; artificial intelligence; neural network