Chiplet关键技术与挑战

李乐琪，刘新阳，庞健

（深圳市中兴微电子技术有限公司，中国 深圳 518081）

摘要：半导体产业正在进入后摩尔时代，Chiplet应运而生。介绍了Chiplet技术现状与接口标准，阐述了应用于Chiplet的先进封装种类：多芯片封装（MCM）、2.5D封装和3D封装，并从技术特征、应用场景等方面介绍了这些封装技术的进展。提出了未来发展Chiplet的重要性和迫切性，认为应注重生态建设，早日建立基于Chiplet的技术标准。

关键词：Chiplet；2.5D封装；3D封装；先进封装

Key Technologies and Challenges of Chiplet

LI Leqi, LIU Xinyang, PANG Jian

(Sanechips Technology Co., Ltd., Shenzhen 518081, China)

Abstract：The semiconductor industry is entering the post-Moore era, and Chiplet emerges as the times require. The current status, interface standards of Chiplet technology, and the advanced packaging types applied to Chiplet are introduced, including multichip module (MCM), 2.5D package, and 3D package. The progress of these packaging technologies is discussed from their respective characteristics, application scenarios, etc. The importance and urgency of developing Chiplet in the future are put forward. It is believed that ecological construction should be paid attention to and technical standards based on Chiplet should be established as soon as possible.

Keywords：Chiplet; 2.5D package; 3D package; advanced package