高速高密度光电共封装技术

[摘要] 分析了高速高密度光电共封装中2.5D、3D集成技术，提出并验证了2种2.5D光电共封装结构：采用硅转接板的光电共封装和采用玻璃转接板的2.5D结构，经仿真得到在40 GHz工作时可以实现较低的插入损耗，并进行了工艺验证，制备了硅转接板和玻璃转接板样品。还提出了一种新型基于有机基板工艺的3D光电共封装结构，该结构相比其他2.5D和3D结构尺寸更小、更薄，设计更灵活。对该结构进行了工艺验证，制作了光探测器（PD）与跨阻放大器（TIA）共同集成的三维光电共封装样品。

[关键词] 光电共封装；光电封装；混合集成；三维封装

[Abstract] In this paper, high-speed and high-density optoelectronic co-packaging structures are analyzed. Two optoelectronic 2.5D co-packaging structures, including co-package based on silicon interposer and glass interposer are proposed and fabricated. Simulation results show that low insertion loss can be achieved in 40 GHz operation. A new optoelectronic 3D co-packaging structure based on the organic substrate process is proposed. Compared with other 2.5D and 3D, the structure is smaller and thinner, and the design is more flexible. The three-dimensional photoelectric co packaging samples integrated with photodetector (PD) and trans-impedance amplifier (TIA) are fabricated.

[Keywords] optoelectronic co-package; optoelectronic package; hybrid integration; 3D package